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 ■ Application for Postdoctoral Fellowship under 21st Century Program on Urban Earthquake Engineering
  1. OUTLINE OF THE FELLOWSHIP  
    The purpose of this Fellowship is to provide opportunities for young postdoctoral researchers to conduct research related to Urban Earthquake Engineering.

  2. NUMBER OF FELLOWSHIPS AWARDED
    - 2004 Recruitment: Some

  3. APPLICATION ELIGIBILITY  
    The applicant must be under the age of 34 as of April 1 of the recruited year and hold a doctoral degree when the Fellowship goes into effect, and is able to conduct research related to Urban Earthquake Engineering. (application is wellcome from those who are interested in our program that promotes earthquake engineering awareness in the general public through Internet)

  4. DURATION AND TERMS OF FELLOWSHIPS
    - 2004 Recruitment: April 1, 2004 - March, 2005
    - Contract will be renewed at the end of each fiscal year and can be extended to the end of the fiscal year of 2005 (March, 2006).
    - Working condition is 40 hours/ week or 30 hours/ week.
    - The amount of the fellowships will be based on our university's regulation.

  5. APPLICATION PROCEDURE
    Applications for this progam must be submitted to one of the offices indicared below.

    Materials to be prepared by the aplicant and submitted to the office:
    (1) Application form to be filled in by the applicant
    (2) Letter of recommendation
    (3) A pdf-file of the application form (to be sent to cuee@arch.titech.ac.jp)

  6. APPLICATION DEADLINE  
    - January 29 at 5 p.m. (administrative office will accept application from January 26, 2003)

  7. CONTACT ADDRESSES

    Center for Urban Earthquake Engineering (CUEE), Suzukakedai Office
    Dept. of Built Environment (G3-904)
    Tokyo Institute of Technology
    4259 Nagatsuta-cho, Midori-ku, Yokohama, 226-8502 JAPAN

    Center for Urban Earthquake Engineering (CUEE), O-okayama Office
    Dept. of Architecture and Building Engineering (Midorigaoka 1-402)
    Tokyo Institute of Technology
    2-12-1 O-okayama, Meguro-ku, Tokyo 152-8552 JAPAN

    Email: cuee@arch.titech.ac.jp



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