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 ■ Application for Postdoctoral Fellowship under 21st Century Program on Urban Earthquake Engineering

  1. OUTLINE OF THE FELLOWSHIP  
    The purpose of this Fellowship is to provide opportunities for young postdoctoral researchers to conduct research related to Urban Earthquake Engineering.

  2. NUMBER OF FELLOWSHIPS AWARDED
    -number of posiions available: variable

  3. APPLICATION ELIGIBILITY  
    The applicant must be under the age of 34 as of April 1 of the recruited year and hold a doctoral degree when the Fellowship goes into effect, and is able to conduct research related to Urban Earthquake Engineering.

  4. DURATION AND TERMS OF FELLOWSHIPS
    - 2007 Recruitment: April 1, 2007-March 31, 2008
    - Contract will be by the end of the fiscal year of 2007 (March, 2008).
    - Working condition is 40 hours/ week or 30 hours/ week.
    - The amount of the fellowships will be based on our university's regulation.

  5. APPLICATION PROCEDURE  
    Applications for this progam must be submitted to one of the offices indicared below.

    Materials to be prepared by the aplicant and submitted to the office:
    (1) Application form to be filled in by the applicant
    (2) Letter of recommendation
    (3) A pdf-file of the application form (to be sent to apply@cuee.titech.ac.jp)

  6. APPLICATION DEADLINE  
    - The deadline of application is Feb. 13, 5pm.(JST)
       If the positions are not filled by the deadline, we will continue receiving application
       until the positions are filled.
       Please contact the CUEE office for further information.

  7. CONTACT ADDRESSES  
    Center for Urban Earthquake Engineering (CUEE), Suzukakedai Office
    Dept. of Built Environment (G3-904)
    Tokyo Institute of Technology
    G3-11, 4259 Nagatsuta-cho, Midori-ku, Yokohama, 226-8502 JAPAN

    Center for Urban Earthquake Engineering (CUEE), O-okayama Office
    Dept. of Architecture and Building Engineering (Midorigaoka 1-402)
    Tokyo Institute of Technology
    M1-39, 2-12-1 O-okayama, Meguro-ku, Tokyo 152-8552 JAPAN

    Email: apply@cuee.titech.ac.jp


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